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shashim-quic
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Mar 6, 2026
This reverts commit 4e3e557. Revert v2 of this patch and bring-in v3 of the patch which has DT name change and minor fixes. Signed-off-by: Umang Chheda <umang.chheda@oss.qualcomm.com>
The Interface Plus [IFP] Mezzanine is an hardware expansion add-on
board designed to be stacked on top of Lemans EVK.
It has following peripherals :
- 4x Type A USB ports in host mode.
- TC9563 PCIe switch, which has following three downstream ports (DSP) :
- 1st DSP is routed to an M.2 E-key connector, intended for
WLAN modules.
- 2nd DSP is routed to an M.2 B-key connector, intended for
cellular modems.
- 3rd DSP with support for Dual Ethernet ports.
- eMMC.
- Additional 2.5GbE Ethernet PHY connected to native EMAC with support for
MAC Address configuration via NVMEM.
- EEPROM.
- LVDS Display.
- 2*mini DP.
Add support for following peripherals :
- TC9563 PCIe Switch.
- Additional 2.5GbE Ethernet Port.
- EEPROM.
Enable support for USB hub, LVDS display and mini-DP later once
dependent changes are available in lemans-evk core-kit.
Written with inputs from :
Mohd Ayaan Anwar <mohd.anwar@oss.qualcomm.com> - Ethernet.
Krishna Chaitanya Chundru <krishna.chundru@oss.qualcomm.com> - PCIe
Monish Chunara <monish.chunara@oss.qualcomm.com> - EEPROM.
Signed-off-by: Umang Chheda <umang.chheda@oss.qualcomm.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com>
Link: https://lore.kernel.org/lkml/20260304165925.1535938-1-umang.chheda@oss.qualcomm.com/
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Test Matrix
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shashim-quic
approved these changes
Mar 7, 2026
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Rebase lemans-evk-ifp-mezzanine changes to latest version (v4) of patch posted upstream.
This change reverts v3 patch and brings-in v4 patch to bring-in the DT name change which was suggested by maintainers.
V4 is needed to be rebased to prevent renaming the board name in meta-qcom once the final version of patch is merged.
CRs-Fixed: 4436746