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fix: correct cool plate temps for Snapmaker PLA SnapSpeed @U1 (60°C → 35°C)#417

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fix: correct cool plate temps for Snapmaker PLA SnapSpeed @U1 (60°C → 35°C)#417
kbaker827 wants to merge 1 commit into
Snapmaker:mainfrom
kbaker827:fix/pla-snapspeed-cool-plate-temp

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Summary

The Snapmaker PLA SnapSpeed @U1 and @U1 base filament profiles had cool_plate_temp and cool_plate_temp_initial_layer hardcoded to 60°C, inconsistent with the sibling @U1 base2 preset (35°C) and generic PLA defaults. This caused the bed to overheat when using a cool/engineering plate.

Closes / supersedes #282.

Changes

  • Snapmaker PLA SnapSpeed @U1 base.json: cool_plate_temp 60→35, cool_plate_temp_initial_layer 60→35
  • Snapmaker PLA SnapSpeed @U1.json: same corrections

Test plan

  • Load the Snapmaker PLA SnapSpeed @U1 filament profile with a Cool Plate — verify bed target is 35°C not 60°C
  • Confirm Engineering Plate and High Temp Plate temperatures are unchanged

…eed @U1 (60 -> 35 C)

The @U1 and @U1 base presets had cool_plate_temp and cool_plate_temp_initial_layer
hardcoded to 60°C, inconsistent with the @U1 base2 preset (35°C) and generic PLA
defaults. This caused the bed to overheat to 60°C when using a cool plate.
Correct to 35°C to match sibling profiles.
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